Vol. 6, №1, 2014
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NANOSTRUCTURES FOR INFORMATION TECHNOLOGIES


THIN-FILM IMPLEMENTATION OF ELECTRICAL SEMI-INTEGRATOR
Krupenin S.V., Kolesov V.V.
Kotel’nikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences, http://www.cplire.ru,
11/7, Mokhovaya str., 125009 Moscow, Russian Federation
krupenin@cplire.ru

Analogue realization of the semi-integrator based on distributed RC components is presented. Samples of the semi-integrator are fabricated by means of high-vacuum thin-film deposition and photolithography. Frequency-band semi-integration is verified by measurements of samples characteristics.

Keywords: semi-integrator, distributed RC components, thin films

UDC 551.501.8 + 621.396.96

Bibliography- 57 references
Received 08.10.2010

RENSIT, 2010, 2(1-2):74-90

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